DESENVOLVEDOR PACKAGING FOTONICO PL

HwIT is seeking a Packaging & Product Development Engineer focused on optical commutations products. You will be a key technical contributor supporting the hardware lifecycle of our photonic modules — from assisting in mechanical/thermal simulations and 3D CAD design to the execution, validation, and optimization of cleanroom packaging processes.

Your main focus will be a hands-on environment bridging R&D design with manufacturing reality: supporting multiphysics simulations, detailing micro-assemblies, executing DOEs (Design of Experiments) for method validation, and technically investigating root causes to ensure structural integrity and maximize yield in global scale production.

1. Product Development and Validation

·       Mechanical & Optomechanical Design for Packaging: Develop 3D CAD models and detailed 2D manufacturing drawings for high-precision optoelectronic packages, test fixtures, and structural assemblies, applying GD&T standards.

·       Multiphysics & Thermal Simulation: Conduct Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) to simulate thermal dissipation, mechanical stress, and structural integrity of photonic modules.

·       Prototyping & Design Validation: Support the rapid prototyping phase and work closely with the Reliability testing team to validate simulation models against empirical data from testing (e.g., Telcordia GR-468, MIL-STD).

2. Process Development and Validation

·       Critical Parameter Optimization: Assist in defining and optimizing critical process parameters such as die attach (e.g., conductive epoxies, eutectic soldering), wire bonding, and optical alignment.

·       Encapsulation Techniques: Develop hermetic and semi-hermetic encapsulation techniques for photonic modules.

·       Material Qualification: Validate new materials, adhesives, and sealing processes according to high-reliability standards.

3. Yield Optimization and Troubleshooting

·       Root Cause Investigation: Run investigative activities in cleanroom processes to detect the root cause of issues affecting the yield and assembly times of photonic components.

·       Design of Experiments (DOE): Run DOEs to characterize processes, define critical variables, and find the best assembly recipes.

·       SPC Alignment: Validate and approve operational methods and process parameters consistent with the Statistical Process Control (SPC) required by Product Engineering.

4. NPI Integration and Manufacturability

·       Design for Manufacturing (DFM): Execute DFM and development activities in packaging components under senior guidance, promoting technical alignment between suppliers and developers, and evaluating the technical feasibility of new components.

·       Team Training: Documentation and training the operational team in the meticulous execution of complex encapsulation recipes and methodologies;

·       Process Transference: Collaborate side-by-side with Product Engineers and Senior Packaging Engineers to validate assemblies and transfer packaging assembly processes to high-volume manufacturing sites.

Education & Background

Essential:

·       Bachelor’s Degree in Materials Engineering, Mechanical Engineering, Electronics, Physics, or related fields.

·       Minimum of 2–5 years of solid experience in microelectronic or optoelectronic packaging processes.

·       Knowledge of structural adhesives, precision soldering, and interconnect metallurgy.

·       Familiarity with failure analysis methodologies (SEM, EDS, X-Ray, Cross-section).

·       Experience in optomechanical design, precision mechanics, or electronic hardware packaging.

·       Proficiency in 3D CAD software (e.g., SolidWorks, Creo, Inventor) and understanding of GD&T.

·       Track record participating in thermal and structural simulations using tools like ANSYS, COMSOL, or SolidWorks Simulation.

Desirable:

·       Experience with PICs (Photonic Integrated Circuits) and fiber-to-chip interfaces.

·       Knowledge of reliability standards (MIL-STD-883, Telcordia GR-468, or NASA EEE-INST-002).

·       Experience with continuous improvement tools (Six Sigma, Lean Manufacturing).

·       Knowledge of automation programming in Python, C#, or LabVIEW.

·       Experience designing complex hermetic packages (e.g., Butterfly, TO-can) and managing micro-assembly tolerances.

·       Background in designing customized mechanical fixtures for High-Temperature Operating Life (HTOL) and environmental testing.

Languages

·       Portuguese: Native;

·       English: Mandatory — Advanced/Fluent (B2/C1 level) for day-to-day communication with international partners.

·       Spanish: Desirable.

Localidade: Campinas